Wafer Improvement

Wafer batter must disperse uniformly, spread into a thin layer and bake into a crisp sheet without excessive particle perception. Flour fineness therefore interacts with batter consistency and sheet formation, making particle size a practical formulation lever.

What can we help you achieve?

• Better crispness
  A clean, well-defined crunch makes wafers feel fresher and more satisfying from the first bite.

• Improved machinability
  A wider processing window can reduce corrective handling and help production run more efficiently.

• Consistent quality
  Greater stability can reduce batch variation and support more predictable finished quality.

Our Recommended Ingredient Solution

• OryzaFINE
  This ingredient can provide texture and structure building and coating and crisping in this formulation. Its defining difference is particle size: OryzaFINE is micronised to below 90 microns, making it especially relevant where smooth dispersion, thin doughs or low particle perception matter.

Of course no two formulations are alike and your best choice may also depend on factors beyond pure functionality. Let us help you find the ingredient solutions that best fit your application, with specifications, samples and recipe support when available.